Plate size: 50*50-350*380mm
Plate thickness: 0.4-3.6mm
Plate speed: 0--200mm/S
Product accuracy: ±0.5
Power supply: 220V 4KW
Precision control: CCD camera positioning, Mark calibration
Suction mode: Upper/lower suction
Cutting motor power: 500W
Product fixture testing: Yes
Cutting motor speed: 13000 RPM
Number of platforms: 2
Partition mode: serrated knife
Blade automatic compensation: Yes
Equipment size: L1065*W1065*H1520
1. Action flow: feeding - entering the cutting area - blade loss detection (software can set the number of slices to be cut) - visual phase taking (Mark point recognition compensation) - X direction sub-board - Angle rotation of cutting blade group - Y direction sub-board - cutting
2. The cutting section of the product is smooth and smooth, without breaking edge burrs. High precision and consistent cutting size.
3. Blade line speed 3200M/Min. The stress of the sub-plate is small, and the actual test stress of the sub-plate is less than half of the stress of the milling cutter type sub-plate.
4. Fast splitter efficiency, the actual splitter speed is more than 100mm per second.
5. Equipment accuracy: ±0.01mm. Plate accuracy: ±0.05mm
6. Adopt high quality, high temperature resistant wafer cutting blade. Our company adopts the maximum 79mm diameter blade, the maximum degree of saving blade, and can also cut the components with high PCBA, the height limit is within 10mm.
7. Power supply: two-phase: AC220V 60HZ
8. Anti-stay function:
A.cba is not put well or different models, Mark point identification alarm.
B.cba not fixed adsorption, adsorption negative pressure gauge alarm.
c. Blade wear Z-axis automatic compensation, reach the limit equipment alarm.

- The warranty period of the whole equipment is one year. If there are quality problems, we will provide free after-sales maintenance and replacement.